Electrochemical deposition of copper on n-Si/TiN

  1. Oskam, G.
  2. Vereecken, P.M.
  3. Searson, P.C.
Revue:
Journal of the Electrochemical Society

ISSN: 0013-4651

Année de publication: 1999

Volumen: 146

Número: 4

Pages: 1436-1441

Type: Article

DOI: 10.1149/1.1391782 GOOGLE SCHOLAR